Purechip（澈芯科技）总部位于苏州，以上海研发中心为技术引擎，构建了光、机、电、算、软、工全链条的协同创新体系。公司专注于先进半导体工艺设备与精密量检测设备的研发制造，产品广泛应用于先进封装，化合物半导体及硅基前道制程。通过提供以客户需求为导向的定制化解决方案，澈芯科技旨在成为推动产业创新的核心伙伴，最终实现与客户的深度协同与共赢发展。

双面对准接近式光刻机

Compact Mask Aligner Platform

SUME MA-L8 采用创新的模块化架构设计，在实现高精度光刻对准的同时，集成键合对准功能，显著提升工艺灵活性。用户可根据实际生产需求灵活配置模块，快速适配多样化工艺流程，满足定制化生产需求。

The SUME MA-L8 adopts an innovative modular architecture design.While achieving high-precision lithography alignment, it integrates bonding alignment functionality,significantly  enhancing process flexibility.Users can fexibly  configure modules based on actual production  requirements, quickly adapt to diverse process fows, and meet customized production needs.

晶圆键合设备

Wafer Bonding System

SUME BW520是PureChip Tec. 澈芯科技推出的高精度晶圆键合设备，作为实现系统微型化与三维集成的核心工艺设备，特别适用于先进MEMS/MOEMS器件的小批量研发与生产，具备完善的工艺功能，可满足多样化的微系统集成需求。

PureChip SUME BW520 is a high-precision wafer bonding system serving as a core process tool for system miniaturization and 3D integration applications. Specifically engineered for low-volume R&D and small-scale production environments, this advanced system delivers complete process functionality to meet diverse microsystem integration requirements, particularly for advanced MEMS/MOEMS device fabrication.

无图晶圆缺陷检测设备(硅基)

Unpatterned Wafer Defect Inspection

PureChip Thea SP Series 采用自研低噪声探测器、高功率紫外激光、高速旋转台，为IC厂、晶圆、设备、材料的研发与量产提供高产率、高灵敏度的无图案缺陷检测解决方案。

PureChip Thea SP Series use low noise sensor,high power DUV laser,and high spindle to simultaneously provide high throughout and high sensitivity inspection solutions for lC FABs, wafer houses,equipment manufacturers,and material providers during both R&D and mass production.

无图晶圆缺陷检测设备（化合物）

Unpatterned Wafer Defect Inspection

PureChip Thea Cx20 Series采用自研低噪声探测器、高功率紫外激光、高速旋转台，为IC厂、晶圆、设备、材料的研发与量产提供高产率、高灵敏度的无图案缺陷检测解决方案。

PureChip Thea CX20 Series use low noise sensor, high power DUV laser, and high spindle to simultaneously provide high throughout and high sensitivity inspection solutions for IC FABs, wafer houses, equipment manufacturers, and material providers during both R&D and mass production.

套刻误差量测设备

Overlay Metrology System

PureChip Warcher Series采用自研高亮宽谱光源、高像质物镜和低噪声探测器，树立高产率、高精度和高重复性的图形套刻量测标杆。

PureChip Warcher Series are driven by proprietary high intensity broadband light source, high resolution objective,and low noise sensor.The goal is to set the image overlay measurement standard with high throuqhput, high accuracy, and high repeatability.

有图形晶圆缺陷检测设备

Patterned Wafer Defect inspection

PureChip Cagle Series采用大NA物镜和高速探测器，为逻辑、存储客户提供高灵敏度、高产率、高检出率的有图案晶圆纳米级缺陷检测解决方案。

By adopting proprietary large-NA objective, and high speed sensitive sensor, PureChip Cagle Series enable the discovery of yield critical defects on logic and memory technology nodes to provide customers with stale-of-the-art inline optical inspection solutions.